There are many reasons that sputtering targets fail. Some are material specific, while others can be avoided or prolonged by reviewing a few things before sputtering begins.
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The amount of power that can be applied varies by material. Visit www.lesker.com sputtering target pages for recommendations on most common materials.
Some materials require a slow ramp up in power. Applying too much power quickly can cause many materials, especially ceramics and low melting point materials, to fail before deposition can even begin. See our website for a ramping procedure that can be used in these cases.
Many materials perform better with bonding. Bonding the target to a backing plate allows for better cooling, adds stability to thin targets, and allows sputtering to continue after minor cracking occurs. Bonding a target will limit the amount of power that can be applied to ~20 watts/square inch. For specifics on which materials are recommended to be bonded, please visit www.lesker.com sputtering target pages prior to ordering.
Some materials will actually melt during sputtering. Using very low power and bonding these materials can sometimes make sputtering possible, but there are some cases where sputtering is just not possible.
When encountering broken targets, if all other parameters seem to be within control, the sputtering gun should be reviewed to ensure that the face of the cathode is within flat. If the cathode is not flat, the target will not be in good contact to provide adequate cooling during sputtering. Though it seems obvious, something as simple as not making sure the cooling water is turned on can cause overheating and failures.
Even when controlling how much power is applied, and how quickly it's applied along with taking bonding into consideration, targets will fail. Targets are considered consumables, but reviewing the parameters above should help extend the lifetime of most sputtering targets.
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Intended application: Selecting the right target material first requires an in-depth understanding of the application requirements of the film. Different applications (e.g., photovoltaics, semiconductors, decorative coatings) have different requirements for the electrical, optical and mechanical properties of thin films. Therefore, defining the application purpose and performance requirements of the film is the first step in target selection.
Evaluate target properties: After determining the application needs of the film, the target needs to be selected based on its purity, compositional homogeneity, size and shape. For example, for highly transparent optical films, it is particularly important to select targets with uniform composition and high purity. For large-area coatings, target size and shape uniformity are critical to improving deposition efficiency and film uniformity.
Consider cost-effectiveness: When selecting targets, there is also a balance of cost-effectiveness to consider. While high-quality targets may cost more, they may be more economical in the long run by providing superior film performance and longer service life.
Equipment and target compatibility: Ensure that the specification, size and shape of the target purchased matches the equipment requirements, and that the physical and chemical properties of the selected material are suitable for the required application and equipment to ensure that it can be loaded and used correctly.
Sputtering method: For reactive sputtering or the preparation of thin films of specific compounds, targets matching the gases used in the sputtering process are required. High-frequency sputtering or magnetron sputtering are generally more suitable for using pure, homogeneous targets for stable deposition. Some sputtering methods may require targets of special shapes, sizes, or structures, such as magnetron sputtering, which improves target utilization. The choice of sputtering method needs to take into account the physical and chemical properties of the target to ensure that it is compatible with the process and that the desired film properties are obtained.
Conductivity: The higher the purity of the target, the higher the conductivity. In semiconductor and conductive film applications, trace impurities can significantly affect the conductivity of the material. High purity targets reduce these impurities and provide higher conductivity, which is critical for high performance electronics.
Specialized resources and guidance are critical to selecting the right target, and by partnering with AEM, a supplier of specialized sputtering targets, we will utilize our years of technical knowledge and experience to help you more accurately select the target that meets your needs.
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