Collabora custom ARM hardware build farm
When you make something, cleaning it out of structural debris is one of the most vital things you do
Collabora recently had a problem with a project's ARM build farm. In a nice change of pace it was not that the kernel was crashing, nor indeed any of the software or hardware.
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The Problem
Instead our problem was our build farm could best be described as "a pile of stuff" and we wanted to add more systems to it and have switched power control for automated testing.
Which is kinda where the Christopher Alexander quote comes into this. I suggested that I might be able to come up with a better, or at least cleaner, solution.
The Idea
19 inch subracks for mounting circuits inside submodules.
I originally envisaged the dev boards individually mounted inside these boxes. However preliminary investigation revealed that the enclosures were both expensive and used a lot of space which would greatly increase the rack space required to house these systems.
I decided to instead look at eurocard type subracks with carriers for the systems. Using my 3D printer I came up with a carrier design for the imx53 QSB and printed it. I used the basic eurocard size of 100mm x 160mm which would allow the cards to be used within a 3U subrack.
Once assembled it became apparent that each carrier would be able to share resources like power supply, ethernet port and serial console via USB just as the existing setup did and that these would need to be housed within the subrack.
The Prototype
The carrier prototype was enough to get enough interest to allow me to move on to the next phase of the project. I purchased a Schroff -194 subrack kit and three packs of guide rails from Farnell and assembled it.
Initially I had envisaged acquiring additional horizontal rails from Schroff which would enable constructing an area suitable for mounting the shared components behind the card area.
Unfortunately Schroff have no suitable horizontal profiles in their catalog and are another of those companies who seem to not want to actually sell products to end users but rather deal with wholesalers who do not have their entire product range!
Undaunted by this I created my own horizontal rail profile and 3D printed some lengths. The profile is designed to allow a 3mm thick rear cover sheet attached with M2.5 mounting bolts and fit rack sides in the same way the other profiles do.
At this point I should introduce some information on how these subracks are dimensioned. A standard 19 inch rack (as defined in IEC ) has a width of 17.75 inches(450.85mm) between the vertical posts. The height is measured in U (1.75 inches)
A subrack must obviously fit in the horizontal gap while providing as much internal space as possible. A subrack is generally either 3 or 6 U high. The width within a subrack is defined in units called HP (Horizontal Pitch) which are 0.2 inches(5.08 mm) and subracks like the Schroff generally list 84 usable HP.
However we must be careful (or actually just learn from me stuffing this up ;-) as the usable HP is not the same thing as the actual length of the horizontal rails! The enclosures actually leave and additional 0.1 inch at either end giving a total internal width of 85HP (17 inches, 431.8 mm) which leaves 0.75 inches for the subrack sides and some clearance.
The Schroff subrack allows eurocards to be slotted into rails where the card centre line is on HP boundaries, hence we describe the width of a card in the slot in terms of HP
I cannot manufacture aluminium extrusions (I know it is a personal failing) nor produce more than 100 mm long length of the plastic profile on my printer.
Even if full lengths are purchased from a commercial service (120 euros for a pair including tax and shipping) the plastic does not have sufficient mechanical strength.
The solution I came up with was somewhat innovative, as an alternative a M5 bolt into a thread in the aluminium extrusion I used a 444mm long length of 4mm threaded rod with nuts at either end. This arrangement puts the extrusion under compression and gives it a great deal of additional mechanical strength as the steel threaded rod is very strong.
Additionally to avoid having to print enough extrusion for the entire length I used some 6mm aluminium tube as a spacer between 6HP(30.48mm) wide sections of the printed extrusion.
It was intended to use a standard modular PC power supply which is 150mm wide which is pretty close to 30HP (6 inches) so it was decided to have a 6HP section of rail at that point to allow a rear mounting plate for the PSU to be attached.
This gives 6HP of profile, 21HP(106.68mm) of tube spacer, 6HP of profile, 46HP(233.68 mm) of tube spacer and a final 6HP profile summing to our total of 85HP. Of course this would be unnecessary if a full continuous 85HP rail had been purchased, but 6 of 6 HP long profile is only 51 euro a saving of 70 euro.
To provide a flat area on which to mount the power switching, Ethernet switch and USB hubs I ordered a 170 x 431 mm sheet of 3mm thick aluminium from inspiredsteel who, while being an ebay company, were fast, cheap and the cutting was accurate.
Do be sure to mention you would prefer it if any error made the sheet smaller rather than larger or it might not fit, for me though they were accurate to the tenth of a mm! If you would prefer the rear section of the rack to be enclosed when you are finished, buy a second sheet for the top. For my prototype I only purchased a 170 x 280mm sheet as I was unsure if I wanted a surface under the PSU (you do, buy the longer sheet)
Mounting the PSU was a simple case of constructing a 3 mm thick plate with the correct cutouts and mounting holes for an ATX supply. Although the images show the PSU mounted on the left hand side of the rack this was later reversed to improve cable management.
The subrack needed to provide Ethernet switch ports to all the systems. ATP-Link TL-SFDS 16-Port 10/100Mbps Switch was acquired and the switch board removed from its enclosure. The switch selected has an easily removed board and is powered by a single 3.3V input which is readily available from the ATX PSU.
Attention now returned to the eurocard carriers for the systems, the boards to be housed were iMX53 QSB and iMX6 SABRE Lite and a Raspberry Pi control system to act as USB serial console etc.
The carriers for both main boards needed to be 8HP wide, comprised of:
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- Combined USB and Ethernet Jack on both boards was 30 mm tall
- PCB width of 2mm
- underside components of 4mm
- clearance between boards of 2mm
Although only 38 mm this is 7.5HP and fractions of an HP are not possible with the selected subrack.
With 8HP wide modules this would allow for ten slots, within the 84 usable HP, and an eleventh 4HP wide in which the Raspberry Pi system fits.
Carrier designs for both the i.MX53 QSB and the i.MX6 SABRE Lite boards were created and fabricated at a professional 3D print shop which gave a high quality finish product and removed the perceived risk of relying on a personal 3D printer for a quantity of parts.
This resulted in changes in the design to remove as much material as possible as commercial 3D services charge by the cubic cm. This Design For Manufacture (DFM) step removed almost 50% from the price of the initial design.
The i.MX6 design underwent a second iteration to allow for the heatsink to be mounted and not mechanically interfere with the hard drive (although the prototype carrier has been used successfully for a system that does not require a hard drive). The lesson learned here is to be aware that an design iteration or two is likely and that it is not without cost.
The initial installation was to have six i.MX53 and two i.MX6 this later changed to a five/four split, however the carrier solution allows for almost any combination, the only caveat (discovered later) is the imx53 carriers should be to the right hand side with the small 4HP gap at that end as they have a JTAG connector underneath the board which otherwise foul the hard drive of the next carrier.
A wiring loom was constructed for each board giving them a connector tail long enough to allow them to be removed. This was the wrong approach! if you implement this design (or when I do it again) the connector tails on the wiring loom should present all the connections to the rear at the same depth as the Ethernet connection.
The rack cables themselves should be long enough to allow the slides to be removed but importantly it is not desirable to have the trailing cable on the cards. I guess the original eurocard designers figured this out as they designed the cards around the standard fixed DIN connectors at the back of the card slots.
We will now briefly examine a misjudgement that caused the initially deployed solution to be reimplemented. As the design was going to use USB serial converters to access the serial console a USB connected relay board was selected to switch the power to each slot. I had previously used serial controlled relay boards with a USB serial convertor however these were no longer available.
All the available USB relay boards were HID controlled, this did not initially seem to be an issue and Linux software was written to provide a reasonable interface. However it soon became apparent that the firmware on the purchased board was very buggy and crashed the host computer's USB stack multiple times.
Deployed solution
Once it became apparent that the USB controlled power board was not viable a new design was conceived. As the Ethernet switch had ports availableEthernet controlled relay boards were acquired.
It did prove necessary to design and print some PCB support posts with M3 nut traps to allow the relay boards to be easily mounted using double sided adhesive pads.
By stacking the relay boards face to face and the Ethernet switch on top separated using nylon spacers it was possible to reduce the cable clutter and provide adequate cable routing space.
A busbar for Ground (black) and unswitched 12V (yellow) was constructed from two lengths of 5A chock block.
An issue with power supply stability was noted so a load resistor was added to the 12V supply and an adhesive thermal pad used to attach it to the aluminium base plate.
It was most fortunate that the ethernet switch mounting holes lined up very well with the relay board mounting holes allowing for a neat stack.
This second edition is the one currently in use, it has proved reliable in operation and has been successfully updated with additional carriers.
The outstanding issues are mainly centered around the Raspberry Pi control board:
- Needs its carrier fitting. It is currently just stuck to the subrack end plate.
- Needs its Ethernet cable replacing. The existing one has developed a fault post installation.
- Needs the USB hub supply separating from the device cable. The current arrangement lets the hub power the Pi which means you cannot power cycle it.
- Connect its switched supply separately to the USB hub/devices.
Shopping list
The final bill of materials (excluding labour and workshop costs) which might be useful to anyone hoping to build their own version.
Prices are in GBP currency converted where appropriate and include tax at 20% and delivery to Cambridge UK and were correct as of April .
The purchasing was not optimised and for example around 20GBP could be saved just by ordering all the shapeways parts in one order.
Base subrack
ItemSupplierQuantityLine Price
Schroff -194 subrack kit
Farnell
1
41.28
Schroff -351 guide rails
Farnell
3
13.65
Schroff rack rear horizontal rail
Shapeways
2
100.00
mm length of 4mm threaded rod
B and Q
1
1.48
170mm x 431mm x 3mm Aluminium sheet
inspired steel
2
40.00
PSU mounting plate
Shapeways
1
35.42
PCB standoff
Shapeways
4
22.30
160mm Deep Modular PC supply
CCL
1
55.76
TP-Link TL-SFDS 16-Port 10/100Mbps-Switch
CCL
1
23.77
8 Channel 16A Relay Board Controlled Via Ethernet
Rapid
2
126.00
Raspberry Pi
Farnell
1
26.48
USB Serial converters
CCL
10
37.40
10 port strip style USB HUB
Ebay
1
7.00
Parts for custom Ethernet cables
RS
13
26.00
Parts for custom molex power cables (salvaged from scrap ATX PSU)
Workshop
11
11.00
33R 10W wirewound resistor for dummy load
RS
1
1.26
24pin ATX female connector pre-wired
Maplin
1
2.99
Akasa double sided thermal pad
Maplin
1
5.00
Small cable tie bases
Maplin
1
6.49
Miscellaneous cable, connectors, nylon standoffs, solder, heatshrink, zip ties, nuts, washers etc.
Workshop
1
20.00
Total for subrack
603.28
The carriers are similarly not optimally priced as over five GBP each can be saved by combining shipping on orders alone. Also the SSD drive selection was made some time ago and a newer model may be more suitable.
i.MX53 QSB carrier
ItemSupplierQuantityLine Price
i.MX53 QSB
Farnell
1
105.52
Intel 320 SSD 80G
CCL
1
111.83
Carrier board
Shapeways
1
30.00
combined sata data and power (15 to 20cm version)
EBay
1
5.00
Low profile right angle 5.5mm x 2.1mm barrel jack
EBay
1
0.25
Parts for 9pin serial cable extension
RS
1
5.00
Miscellaneous solder, heatshrink, nylon nuts, bolts and washers
Workshop
1
5.00
Total for carrier
262.60
i.MX6 SABRE Lite carrier
ItemSupplierQuantityLine Price
i.MX6 SABRE Lite
Farnell
1
128.06
Intel 320 SSD 80G
CCL
1
111.83
Carrier board
Shapeways
1
35.00
combined sata data and power (15 to 20cm version)
EBay
1
5.00
Low profile right angle 5.5mm x 2.1mm barrel jack
EBay
1
0.25
Parts for 9pin serial cable modification
RS
1
2.00
Miscellaneous solder, heatshrink, nylon nuts, bolts and washers
Workshop
1
5.00
Total for carrier
287.14
Conclusion
The solution works and in a 3U high 355mm deep subrack ten ARM development boards can be racked complete with local ethernet switching, power control and serial consoles.
The solution is neat and provides flexibility, density and reproducibility the "pile of stuff" solution failed to do.
For current prototype with nine filled slots the total cost was around GBP or around 330GBP per slot which indicates a 100GBP per slot overhead over the "pile of stuff" solution. These figures omit the costs of the engineer and workshop time, which are estimated at an additional GBP. Therefore a completed rack, fully filled with i.MX6 carriers costs around GBP
Density could be increased if boards with lower height requirements were used however above twelve units there issues with Ethernet switch, power switch and USB port availability become a factor. For Example the 16 port Ethernet switch requires a port for uplink, one for each relay board and one for the console server which leaves only 12 ports for systems.
Addressing the outstanding issues would result in a much more user friendly solution. As the existing unit is in full time use and downtime is not easily scheduled for all ten systems, the issues are not likely to be fixed on the prototype and would have to be solved on a new build.
The solution is probably not suitable for turning into a product but that was not really the original aim. A commercial ARM blade server using this format would almost certainly use standard DIN connectors and a custom PCB design rather than adapting existing boards.
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Standards Access - VITA
VMEbus Handbook, 4th Edition
A user's guide to the VME, VME64 and VME64x bus specifications - features over 70 product photos and over 160 circuit diagrams, tables and graphs. The handbook complements the VMEbus standard and provides examples and explanatory text for all facets of the VMEbus architecture.
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VME64
The VME64 standard establishes a framework for 8-, 16-, 32, and 64-bit parallel-bus computer architectures that can implement single and multiprocessor systems. This bus includes the four basic sub-buses: (1) data transfer bus, (2) priority interrupt bus, (3) arbitration bus, and (4) utility bus. The mechanical specifications of boards, backplanes, subracks, and enclosures are based on IEC 297 and IEEE .1 specifications, also known as the Eurocard form factor.
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VME64x is an extension of the ANSI/VITA 1-, VME64 standard. It defines a set of features that can be added to VME32 and VME64 boards, backplanes and subracks. These features include a 160 pin connector, a P0 connector, geographical addressing, voltages pins for 3.3V, a test and maintenance bus, and EMI, ESD, and front panel keying per IEEE .10.
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VME64x 9U x 400mm Format
This standard is an extension of the ANSI/VITA 1-, VME64 Standard. It defines 9U x 400 mm boards, backplanes and subracks for use in application requiring large format printed circuit boards.
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VME 2eSST
An extension of the ANSI/VITA 1-, VME64 and ANSI/VITA1.1-, VME64x standards, it defines a transfer protocol, based upon source synchronous concepts that permit the VMEbus signalling to operate at rates to at least 320MB/s. The 2eSST protocol requires low skew between signals and monotonic rising and falling edges on the signals. To meet these requirements, limited length backplanes, special backplane topologies and/or enhanced transceivers are required. The standard calls for enhanced bus transceivers with controlled rise and fall times, tightly defined thresholds, low part-to-part skew and LVTTL levels.
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Keying for Conduction Cooled VME64x
This standard is an extension of the VME64x Standard, ANSI/VITA 1.1-. It defines a keying system that can be added to VME64x boards and backplanes in a conduction cooled environment (IEEE .2) where keying as defined in the VME64 Extensions standard cannot be applied.
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Increased Current Level for 96 Pin &160 Pin DIN/IEC Connector
This standard describes increased current levels, test methods, test data and compliance criteria for 3 row DIN and 5 row DIN connectors when used in VME, VME64 and VME64 Extension P1/J1 and P2/J2 pin out arrangements.
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Board Level Live Insertion for VMEbus
This standard identifies methodologies through which a faulty board can be removed from a system and a replacement board can be inserted while the system continues to operate. The primary motivation for supporting Board Level Live Insertion within the VMEbus environment is to enhance the current VMEbus standard while maximizing the use of existing off-the-shelf VMEbus products.
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IP Modules
This standard defines a versatile module, known as an "IP module."These modules provide a convenient method of implementing a wide range of I/O, control, interface, slave processor, analog and digital functions. IP modules, about the size of a traditional business card, mount parallel with a host Carrier board, which provides host processor or primary bus interfacing, as well as mechanical means for connecting the IP module's I/O to the outside world.
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IP I/O Mapping to VME64x
This standard defines the mapping of the 50 user defined I/O pins from the IP (ANSI/VITA 4- (S)) I/O connectors to VME64x board's rear I/O connectors.
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RACEway Interlink on VME
This standard provides a specification of the data link protocol and physical interface of a high performance extension to the VMEbus standard. This extension consists of high bandwidth, low latency interconnects across a VMEbus computer chassis backplane using the P2 connector. Bi-directional connectivity between boards in a VMEbus chassis is achieved through the use of a network of crossbar switches with point-to-point interconnects.
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Signal Computing System Architecture (SCSA) on VME
The Signal Computing System Architecture (SCSA) standard establishes a framework for the inter- and intra-system transfer of serial media data and control information oriented toward the development of high density call and voice processing products and systems. The SCSA architecture is application specific and is embodied as a family of buses that are defined in this physical layer of the specification to reside on the VMEbus J2/P2 connector. The SCSA buses coexist with products compliant with ANSI/VITA 1-, VME64. SCSA at the physical level consists of two separate subbuses, a sixteen line TDM data transfer bus called the SCbus, and a serial, peer-to-peer communication link called the SCmessage bus. The primary purpose of the SCbus is to support the exchange of real time telephonic voice, facsimile, data, video and other media streams. The purpose of the SCmessage bus is to transport interprocess control and status messages. This specification defines only the physical and data link OSI layers of the four layer transport facility.
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This standard contains a set of feature extensions to ANSI/VITA 6- Signal Computing System Architecture (SCSA) which expand the switching capacity of the TDM subbus called the SCbus and provide for redundant buses or bus elements. This standard is built upon the ANSI/VITA 1.1- VME64 Extensions standard.
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SkyChannel Packet on VME P2
This standard provides a specification of the data link protocol and physical interface of a high performance packet bus extension to the VME standard. This extension consists of high bandwidth, low latency packet bus transfers between VMEbus modules using the P2 connector and a network of crossbar designs.
This standard was withdrawn as an ANSI/VITA approved standard and is listed for historical reference only. No further action will be taken with this standard.
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M-Module
This standard defines minimum mechanical and electrical characteristics of M-Modules, a method of implementing modular circuit boards with specific functions that can be used to add functionality to other larger printed circuit boards.
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VMEbus Pin Assignment Standard for ISO/IEC (IEEE Std. - (H.I.C.))
This standard defines a standard pin assignment for ISO/IEC (IEEE Std. - (H.I.C.) heterogeneous interconnect on the VMEbus.
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Front Panel Data Port (FPDP)
This standard provides a specification of the protocol and mechanical characteristics of the Front Panel Data Port. This extension to the VME standard consists of a multidrop synchronous parallel non-addressable bus connection between multiple boards in a single chassis. The connection is made to a connector on the front panel of each board by means of an eighty conductor ribbon cable.
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This document describes a standard for “Serial FPDP ”, a high-speed low-latency serial communications protocol for use in high-speed data transfer applications, typically using a fiber optic link. As the name implies, it is directly related to Standard Front Panel Data Port (FPDP), deriving its serial protocol from the defined protocol and control signals of FPDP. This Serial FPDP standard supports seven link speeds: 1. Gbaud, 2.125, 2.5, 4.25, 5.0, 8.5, and 10.0 Gbaud. These seven link speeds can support data transfer rates in excess of 105 MBps, 210 MBps, 247 MBps, 420 MBps, 494 MBps, 840 MBps, and 988 MBps respectively.
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This standard defines VITA 17.3 “Serial FPDP Gen 3.0 ”(sFPDP), a high-speed serial communications interface. Included in this definition are various user data framing methods, supported system configurations, and the Link Layer Protocol.
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This standard defines VITA 17.3 “Serial FPDP Gen 3.0 ”(sFPDP), a high-speed serial communications interface. Included in this definition are various user data framing methods, supported system configurations, and the Link Layer Protocol.
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BusNet Media Access Control (MAC) Standard
The VME BusNet Protocol is designed to provide a common and unique method for use by two or more devices (participants or peers) for network communication across a backplane. Because the VME BusNet Protocol is context independent, which means the contents of the packets sent across the backplane are independent of the BusNet protocol, most high-level networking protocols available today can be used by peers on the same VMEbus backplane without the need for a second physical interconnection between the participants.
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BusNet Link Layer Control (LLC) Standard
The VME BusNet Protocol is designed to provide a common and unique method for use by two or more devices (participants or peers) for network communication across a backplane. Because the VME BusNet Protocol is context independent, which means the contents of the packets sent across the backplane are independent of the BusNet protocol, most high-level networking protocols available today can be used by peers on the same VMEbus backplane without the need for a second physical interconnection between the participants.
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Conduction Cooled PMC
This standard defines the methodology and implementation details to allow the creation of conduction cooled PMC modules to ensure electrical and physical compatibility with various host card modules onto which conduction cooled PMCs are mounted.
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VME64 Extensions for Physics and Other Applications
This standard defines a series of recommended practices for the use of VMEbus in the physics community. This standard is generally consistent with the NIM/VME-P document , "VMEbus for Physics Applications ", that has served as a working group approach, and has also utilized items from the CERN VSC "Recommended Practices "document.
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VISION (Versatile I/O Software Interface for Open-bus Networks)
VISION (Versatile I/O Software Interface for Open-bus Networks) specifies a standard way to move data among entities connected by a bus, and possibly across a network.
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Myrinet-on-VME Protocol Standard
This standard describes a packet network protocol called Myrinet for communications between VME modules using interconnects either on a front panel or on a backplane. Networks may be module to module, subrack to subrack, and/or chassis to chassis.
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PC*MIP
This standard defines the mechanical and electrical specification for compliance with the PC-MIP mezzanine module. The mechanical specifications are defined in this standard. The electrical specifications are based on the PCI bus. This document provides the appropriate pin assignments.
This standard was withdrawn as an ANSI/VITA approved standard and is listed for historical reference only. No further action will be taken with this standard.
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VITA 30- (S)
2mm Equipment Practice for Eurocard Systems
This standard defines an equipment practice based on a combination of 2 mm connectors, per IEC -4-101, and subracks, racks and printed boards based on the Euroboard form factors.
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VITA 30.1- (S)
2mm Connector Practice on Conduction Cooled Euroboards
This standard is intended to be a companion specification to other standards as referenced. The aim is to ensure mechanical interchangeability of conduction-cooled circuit card assemblies in a format suitable for military and rugged applications and to ensure their compatibility with both conduction cooled chassis and commercial, air-cooled, single height (3U) and double-height (6U) x 160mm, Euroboard chassis.
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VITA 30.2- (IEC)
Power Connector Equipment Practice
This standard describes various separable connectors that can be used to conduct electrical current between two printed boards. Typical applications include power supplies or other power management devices. It has been developed to aid in the design of equipment where such connectors are typically found. The information included consists of interface and profile dimensions, printed board layout dimensions, suggested or actual signal and power pin assignments as well as information regarding standards that may exist for the connectors. Power connectors are defined, for the purpose of this standard, as separable connectors that are designed to provide current to devices at levels consistent with the overall operating power of the device. As such, they must have at least one (1) contact capable of carrying five (5) amps or more of electrical current.
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VITA 31.1- (S)
Gigabit Ethernet on VME64x Backplanes
This standard defines a pin assignment and interconnection methodology for implementing a 10/100/BASE-T Ethernet switched network on an ANSI/VITA 1.1 VME64x backplane.
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ANSI/VITA 32- (S)
Processor PMC
This standard incorporates a set of extensions to the IEEE .1 PMC (“PCI Mezzanine Card ”) standard which creates a new class of CPU based PMC cards referred to in this standard as Processor PMC cards. The standard retains electrical signaling compatibility with existing PMC cards.
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ANSI/VITA 35- (S)
PMC-P4 Pin Out Mapping to VME-P0 and VME64x-P2
This standard provides pin mapping assignments between a PCI mezzanine Card (PMC) module's user IO connector (P4) and the VME host's user IO connector. Four mappings are provided.
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VITA 38- (S)
System Management on VME
This standard is based on the PICMG 2.9 System Management specification and describes the additional requirements for implementing Intelligent Platform Management Interface (IPMI) in a VME system. IPMI describes a hardware independent interface between chassis sensors and the operating system. IPMI is particularly useful for managing servers and High Availability systems.
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VITA 39- (S)
PCI-X for PMC and Processor PMC
This standard integrates the PCI-X capability from PCI to PMC based products, including standard PMCs as well as Processor PMCs.
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ANSI/VITA 40-
Service and Status Indicator Standard
This standard defines the colors, behaviors, placement, and labeling of service and status indicator lamps for boards, field replaceable units, and enclosures.
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Service and Status Indicator Standard
This standard defines the colors, behaviors, placement, and labeling of service and status indicator lamps for boards, field replaceable units, and enclosures.
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VITA 41.0- (S)
VXS VMEbus Switched Serial Standard
The VME Switched Serial (VXS) standards comprises this base standard defining physical features of VXS components, coupled with a set of protocol layer standards to define the specific serial interconnect used in a system implementation. The VXS base standard defines physical features that enable high-speed communication in a VME compatible system. These features include: addition of a high speed connector to the VME64x board in the P0/J0 position, a 6U by 160mm by 6HP Eurocard format board with many high speed connectors which may act as a switch, and the backplane/chassis infrastructure needed to support these features. In addition to defining a high -speed connector in the P0/J0 area, VXS also defines alignment and keying features which may be used to protect this and future alternate connectors.
VITA Stabilized Maintenance
$75
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VITA 41.1- (S)
VXS 4X InfiniBand ™Protocol Layer Standard
This standard describes a method for using the InfiniBand protocol on ANSI/VITA 41.0, VXS.
VITA Stabilized Maintenance
$25
Free
VITA 41.2- (S)
VXS 4X Serial RapidIO Protocol Layer Standard
This standard describes a method for implementing Serial Rapid I/O on ANSI/VITA 41.0, VXS.
VITA Stabilized Maintenance
$25
Free
VITA 41.6- (S)
VXS 1X Gigabit Ethernet Control Channel Layer Standard
This protocol layer document builds upon the VXS-based standard by describing how VXS boards may communicate using the existing data plane protocols with provisions for a separate control plane.
VITA Stabilized Maintenance
$50
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ANSI/VITA 42.0-
XMC: Switched Mezzanine Card (XMC) Auxiliary Standard
This document defines an open standard for supporting high-speed, switched interconnect protocols on an existing, widely deployed mezzanine card form factor. This revision () adds updated signal integrity data for PCIe capabilities as well as revised connector drawings.
ANSI/VITA Approved
$50
Free
VITA 42.1- (S)
XMC Parallel RapidIO 8/16 LP-LVDS Protocol Layer Standard
This standard describes a method for implementing parallel RapidIO on the VITA 42.0, XMC mezzanine form factor.
VITA Stabilized Maintenance
$50
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ANSI/VITA 42.2- (S)
XMC Serial RapidIO Protocol Layer Standard
This standard describes a method for implementing Serial RapidIO on the VITA 42.0, XMC mezzanine form factor.
ANSI/VITA Stabilized Maintenance
$25
Free
ANSI/VITA 42.3-
XMC PCI Express Protocol Layer Standard
This standard describes a method for implementing PCI Express on the VITA 42.0 XMC mezzanine form factor.
This edition revised bit positions and lengths to allow for encodings for PCIe speeds of Gen 3 to Gen 6. Table 5-4 from the VITA 42 standard was added to Sections 4.3.5 and 4.4.5 to address P16 pin definitions. Minor editorial changes to bring in line with current practice.
ANSI/VITA Approved
$50
Free
ANSI/VITA 42.6- (S)
XMC 10 Gigabit Ethernet 4-Lane Protocol Layer Standard
This standard defines a method for supporting 10 Gigabit Ethernet using XAUI switched interconnect protocol on the XMC form factor.
ANSI/VITA Stabilized Maintenance
$25
Free
ANSI/VITA 46.0- +Errata
VPX Baseline Standard
This standard describes VITA 46.0 VPX Baseline Standard; an evolutionary step forward for the provision of high-speed interconnects in harsh environment applications.
This revision adds verification methodologies to all Rules and Recommendations, adds guide socket/pin rotations for additional power supply configurations, provides further clarifications to power wafer current ratings, and makes other changes to clarify the requirements of this standard.
ANSI/VITA Approved
$100
Free
ANSI/VITA 46.1- (S)
VMEbus Signal Mapping on VPX
This standard defines a signal mapping for the VMEbus on ANSI/VITA 46.0, VPX baseline standard.
ANSI/VITA Stabilized Maintenance
$50
Free
ANSI/VITA 46.3- (S)
Serial RapidIO on VPX Fabric Connector
The objectives of this standard are to assign Serial RapidIO ports to the VPX P1/J1 connector and to provide rules and recommendations for the use of the assigned Serial RapidIO ports.
ANSI/VITA Stabilized Maintenance
$50
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ANSI/VITA 46.4- (S)
PCI Express ®on the VPX Fabric Connector
The objective of this standard is to standardize the implementation of the PCI Express Fabric in the VITA46 environment and define the mapping of the PCI Express Links on the VPX Connector.
ANSI/VITA Stabilized Maintenance
$25
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ANSI/VITA 46.6- (S)
Gigabit Ethernet Control Plane on VPX
The objectives of this standard are to assign Gigabit Ethernet Port mappings for the purpose of Control Plane communication onto the VPX connectors for both 3U and 6U form factors and to provide rules and recommendations for the interoperable implementation and use of said Gigabit Ethernet Port mappings.
ANSI/VITA Stabilized Maintenance
$50
Free
ANSI/VITA 46.7- (S)
Ethernet on VPX Fabric Connector
The objectives of this standard are to assign backplane Ethernet links to the VPX P1/J1 connector and to provide rules and recommendations for the use of Ethernet over backplane media.
ANSI/VITA Stabilized Maintenance
$25
Free
ANSI/VITA 46.9- (R)
PMC/XMC Rear I/O Fabric Signal Mapping on 3U and 6U VPX Modules Standard
This document describes an open standard for PMC or XMC mezzanine rear I/O pin mappings to VITA 46.0 plug-in module backplane connectors.
ANSI/VITA Reaffirmed
$75
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ANSI/VITA 46.10- (S)
Rear Transition Module for VPX
This standard defines signal mapping for VPX Rear Transition Modules (RTMs).
ANSI/VITA Stabilized Maintenance
$50
Free
ANSI/VITA 46.11-
System Management on VPX
This document defines a framework for System Management in VPX systems. It enables interoperability within the VPX ecosystem at the Field Replaceable Unit (FRU), chassis and system levels. The framework is based on the Intelligent Platform Management Interface (IPMI) specification and leverages many concepts and definitions from the AdvancedTCA ®(ATCA ®) specification by PICMG ®.
This revision clarifies some requirements and language in the original document and adds support for Tier-3 Chassis Managers and IPMCs, which imposes new requirements, adds support for some new features, and enhances message security. While there is no effect on implementations that claim compliance to VITA 46.11-, Tier-1 and Tier-2 Chassis Managers and IPMCs must update their designs to claim compliance to this revision of the standard.
ANSI/VITA Approved
$100
Free
ANSI/VITA 46.30-
Higher Data Rate VPX
This document defines a standard for a VPX connector that supports higher data rates, to at least 25 Gbaud –for protocols such as 100GBASE-KR4 Ethernet and PCIe Gen 4. The higher data rate connectors compliant to VITA 46.30 are intermateable to legacy VITA 46.0 connectors and follow the same form factor.
ANSI/VITA Approved
$50
Free
ANSI/VITA 46.31-
Higher Data Rate VPX - Solder Tail in Blind via
This document defines a standard for a VPX connector that supports higher data rates, to at least 25 Gbaud –for protocols such as 100GBASE KR4 Ethernet and PCIe Gen 4. The connectors feature a short solder tail intended to be soldered into a blind via. The higher data rate connectors compliant to VITA 46.31 are intermateable to legacy VITA 46.0 connectors and follow the same form factor.
ANSI/VITA Approved
$50
Free
VITA 47 Bundle
VITA 47 Standards Package
A collection of all of the VITA 47 standards in one part number for ease of ordering. All documents are needed to implement the standards.
ANSI/VITA Approved
$75
Construction, Safety, and Quality for Plug-In Modules Standard
The VITA 47 group of standards defines environmental, design and construction, safety, and quality requirements for commercial-off-the-shelf (COTS) Plug-In Modules intended for ground and aerospace applications.
In process for reaffirmation or SM
See VITA 47 Bundle
Free
ANSI/VITA 47.0-
Construction, Safety, and Quality for Plug-In Modules Standard
The VITA 47 group of standards defines environmental, design and construction, safety, and quality requirements for commercial-off-the-shelf (COTS) Plug-In Modules intended for ground and aerospace applications.
ANSI/VITA Approved
See VITA 47 Bundle
Free
ANSI/VITA 47.1-
Common Requirements for Environments, Design and Construction, Safety, and Quality Standard
The VITA 47 group of standards defines Environments, Design and Construction, Safety, Quality Systems, and ESS (Environmental Stress Screening) requirements for commercial-off-the-shelf (COTS) Plug-In Modules intended for commercial and military, ground, naval, and aerospace applications. VITA 47.1 addresses requirements common across the VITA 47 group of standards.
This revision enables a broader use of this standard across the COTS supplier market with added flexibility in environmental class options. It also corrects typographical errors, adds additional requirements for conformance to improve interoperability and maintainability, and rugged design for tactical applications.
Modules aligned to ANSI/VITA 47.1-, primarily Table 3.2-1, might not be aligned to the released ANSI/VITA 47.1- standard. To become compliant with this new update a supplier should revise their module datasheet with the new Figure 3.2 1, Environmental Class Code.
ANSI/VITA Approved
See VITA 47 Bundle
Free
ANSI/VITA 47.2-
Class 2 Requirements for Environments, Design and Construction, Safety, and Quality Standard
The VITA 47 group of standards defines environmental, design and construction, safety, and quality requirements for commercial-off-the-shelf (COTS) Plug-In Modules intended for ground and aerospace applications. VITA 47.2 addresses requirements specific to dedicated service electronic products.
ANSI/VITA Approved
See VITA 47 Bundle
Free
ANSI/VITA 47.3-
Class 3 Requirements for Environments, Design and Construction, Safety, and Quality Standard
The VITA 47 group of standards defines environmental, design and construction, safety, and quality requirements for commercial-off-the-shelf (COTS) Plug-In Modules intended for ground and aerospace applications. VITA 47.3 addresses requirements specific to high performance electronic products.
ANSI/VITA Approved
See VITA 47 Bundle
Free
ANSI/VITA 48.0-
Mechanical Standard for Microcomputers using Ruggedized Enhanced Design Implementation (REDI)
This standard defines a mechanical implementation for Plug-In Modules. Two types of Plug-In Modules are defined: Type 1 and Type 2. Both Type 1 and Type 2 Plug-In Modules take advantage of increased slot pitch to provide enhanced thermal performance and increased structural durability. Type 1 units support Two Level Maintenance while Type 2 units do not.
This revision adds allowance for a 100 mm Plug-In Module depth and allows for additional pitches to be defined in the VITA 48 Dot Standards.
ANSI/VITA Approved
$25
Free
ANSI/VITA 48.1-
Mechanical Standard for VPX REDI
Air Cooling
This standard defines the mechanical requirements that are needed to insure the mechanical interchangeability of air cooled 3U and 6U Plug-In Modules and define the features required to achieve Two Level Maintenance compatibility.
This edition made clarifying editorial changes and modified Table 4, including an observation and permission.
ANSI/VITA Approved
$50
Free
ANSI/VITA 48.2-
Mechanical Standard for VPX REDI
Conduction Cooling
This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility.
This revision adds a 100 mm depth and multiple pitches at 0.2 inch increments.
ANSI/VITA Approved
$50
Free
ANSI/VITA 48.4-
Mechanical Standard for VPX REDI
Liquid Flow Through Cooling
This standard establishes the mechanical design interface control, outline and mounting requirements for a liquid-flow-through cooled Plug-In Module to ensure the mechanical intermateability of 6U VPX liquid-flow-through cooled Plug-In Module within associated sub-racks. The connector layout remains common with VITA 46. This Plug-In Module uses liquid flowing through an integral heatsink of the module for cooling the electronic components and circuit boards. The quick disconnect coupling assemblies allow fluidic coupling to the chassis coolant manifold.
This revision expands the supplier list for COTS components, corrects errors in depicted dimensions, adds additional requirements for conformance to improve interoperability and maintainability, and improves elements to expand the supplier base.
ANSI/VITA Approved
$50
Free
ANSI/VITA 48.5- (R)
Mechanical Standard for VPX REDI
Air Flow Through Cooling, 1.52 "Pitch
This standard establishes the design requirements for an air-flow-through cooled plug-in unit with a form factor as close to 6U as possible while retaining the VITA 46 connector layout. Unlike ANSI/VITA 48.1, which uses cooling air impinged directly upon the components and circuit boards, this plug-in unit uses a compact core heat exchanger located within the central heat sink of the unit.
ANSI/VITA Reaffirmed
$50
Free
ANSI/VITA 48.7-
Mechanical Standard for VPX REDI
Air Flow-By ™Cooling
This standard defines a detailed mechanical implementation for Air Flow-By cooling and sealing technologies applied to plug-in modules, backplanes, and sub-racks as defined in VITA 46/48. Air Flow-By cooling seals, environmentally and EMI, the PCBA within heat exchanging covers, convectively cooling the assembly without exposing the PCBA to the cooling air. This revision provides additional design clarity, removes dependencies on external documentation, adds requirements for plug-in module specifications, and updates recommendations to better guide design practice.
ANSI/VITA Approved
$50
Free
ANSI/VITA 48.8-
Mechanical Standard for VPX REDI
Air Flow Through Cooling, 1.0 "to 1.5 "Pitches
This document describes an open standard for the design requirements for an air-flow-through cooled plug-in module having 3U and 6U form factors while retaining the VITA 46.0 connector layout. Unlike using cooling air impinged directly upon the components and circuit boards, this plug-in module uses a finned heat exchanger frame located within the central section of the assembly to top cool primary circuit board components as well as mezzanine board components. Both 3U and 6U standard form factors are offered using 3 defined pitch spacings, with options to have alternate air flow intake and exhaust paths. The plug-in modules of this standard exhibit a weight reduction and cost savings by eliminating both wedge retainer usage and module lever usage by way of using light weight jack screws for plug-in module insertion and extraction into a subrack chassis. The intention of this standard is to optimize SWAP-C (Size, Weight, Power, Cost).
This revision of the standard updates the plug-in module in the following areas: tab dimensions, thickness, jackscrew, and additional screw. Also, the option for insertion/extraction levers has been removed.
ANSI/VITA Approved
$50
Free
ANSI/VITA 49.0- (R)
VITA Radio Transport (VRT) Standard
The VITA Radio Transport (VRT) standard defines a transport-layer protocol designed to promote interoperability between RF (radio frequency) receivers and signal processing equipment in a wide range of applications. These include spectral monitoring, communications, radar, and others. In support of this variety of applications, the VRT protocol provides a variety of formatting options that allow the transport layer to be optimized for each application. VRT also enables high-precision timestamping to provide time synchronization between multiple receiver channels.
ANSI/VITA Reaffirmed
$100
Free
ANSI/VITA 49.1- (R)
VITA Radio Link Layer (VRL) Standard
This document describes an open standard for an optional encapsulation protocol for VITA-49.0 (VRT) packets.
ANSI/VITA Reaffirmed
$25
Free
ANSI/VITA 49.2- (R)
VITA Radio Transport (VRT) Standard for
Electromagnetic Spectrum: Signals and Applications
The ANSI/VITA 49.2 standard, which is part of the VITA Radio Transport (VRT) family of standards, defines a signal/spectrum protocol that expresses spectrum observation, spectrum operations, and capabilities of RF devices. This is done independent of manufacturer, equipment type, point of use in an architecture and application. The intent of the VRT protocol is to enable RF systems to migrate from proprietary stove-pipe architectures to interoperable multi-function architectures.
ANSI/VITA Reaffirmed
$100
Free
ANSI/VITA 49A- (R)
Spectrum Survey Interoperability Standard
This document specifies an interoperability specification that is applicable to spectrum-survey applications. It is intended to foster high-throughput and adaptable processing in a large-scale environment. It specifically considers the needs of devices based around 32-/64-bit general-purpose processors (GPP) and FPGAs that utilize Internet Protocol (IP) as the underlying transport between processing devices.
ANSI/VITA Reaffirmed
$50
Free
ANSI/VITA 51.0- (S)
Reliability Prediction
This document provides a framework for electronics equipment reliability standards, and establishes a reliability Community of Practice. It addresses the limitations of existing prediction practices with a series of subsidiary specifications that contain the “best practices ”within industry for performing electronics reliability analysis. The development of VITA 51.0 and the subsidiary specifications is an effort to give harmony, consistency and repeatability to reliability practices.
ANSI/VITA Stabilized Maintenance
$25
Free
ANSI/VITA 51.1- (S)
Reliability Prediction MIL-HDBK-217 Subsidiary
This standard defines defaults and methods to adjust the models in MIL-HDBK-217F Notice 2. This is not a revision of MIL-HDBK-217F Notice 2 but a standardization of the inputs to the MIL-HDBK-217F Notice 2 calculations to give more consistent results.
ANSI/VITA Stabilized Maintenance
$50
Free
ANSI/VITA 51.2- (R)
Physics of Failure Reliability Predictions
This standard provides standard processes, instructions and default parameters for using the Physics of Failure (PoF) approach for modeling the reliability of electronic products. It includes a discussion of the philosophy, context for use, definitions, models for key failure mechanisms, definition of the input data required, default values if technically feasible or the typical range of values as a guideline. It defines how modeling results are interpreted and used. It requires the documentation of modeling inputs, assumptions made during the analysis, modifications to the models and rationale for the analysis.
ANSI/VITA Reaffirmed
$75
Free
ANSI/VITA 51.3- (S)
Qualification and Environmental Stress Screening in Support of Reliability Predictions
This standard provides rules, permissions, and observations to assure that cost effective Qualification and Environmental Stress Screening support valid reliability predictions and enhance electronics reliability. It includes a discussion of the systems engineering relationships between Qualification, Environmental Stress Screening, and reliability.
ANSI/VITA Stabilized Maintenance
$25
Free
IEEE Std -/VITA 51.4-
Reliability Component Stress Analysis and Derating
This document describes an open standard for parts stress analysis and derating. It establishes uniform methods to increase a component ’s reliability margin by decreasing the amount of applied stress (i.e., voltage, current, temperature, power, etc.) to an electronic, electrical, or electromechanical part. Reducing the stress levels improves device reliability/durability by reducing failure rates, thereby improving the reliability and availability of the product.
VITA Approved
$62 at IEEE Store
VITA 53.0- (S)
Standard for Commercial Technology Market Surveillance
This standard describes the types of market surveillance data needed by Department of Defense program managers in order to develop and implement technology refresh plans. Technology refresh events are fueling the large majority of new DoD acquisition efforts in the post-"Perry memo "era of increased DoD reliance on commercial technology vendor design, production, support, and repair services.
VITA Stabilized Maintenance
$25
Free
VITA 57 Bundle
VITA 57 FMC and FMC+ Bundle
Includes VITA 57.1 and VITA 57.4 in one part number for ease of ordering. Both documents are needed to implement the standards.
ANSI/VITA Approved
$100
ANSI/VITA 57.1- + Errata
FPGA Mezzanine Card (FMC) Standard
This standard describes the compliance requirements for an FPGA Mezzanine Card (FMC) IO module which utilizes a mezzanine module to provide for a low overhead protocol bridge between a carrier card's front panel IO and an FPGA processing device on the carrier card. This revision provides for larger EEPROMs, relaxes ground requirements, and allows for higher current on 3P3V AUX.
ANSI/VITA Approved
See VITA 57 Bundle
Free
ANSI/VITA 57.4- + Errata
FPGA Mezzanine Card Plus (FMC+) Standard
This standard extends the VITA 57.1 FMC standard by specifying two new connectors that enable additional Gigabit Transceiver interfaces that run at up to 28Gbps. It also describes FMC+ IO modules which support this enhanced version of the FMC electro-mechanical standard. This is between the front panel IO, on the mezzanine module, and an FPGA processing device on the carrier card, which accepts the mezzanine module. Additional signals to support backplane reference clock and synchronization have been added. The VITA 57.4 specification is backwards compatible in that a VITA 57.4 carrier card can still support a VITA 57.1 FMC.
ANSI/VITA Approved
See VITA 57 Bundle
Free
VITA 58.0- (S)
Line Replaceable Integrated Electronics Chassis Standard
This standard provides common design and performance requirements for a family of integrated electronic chassis incorporating updated industry standard high speed electronic assemblies and designed for rugged environments.
VITA Stabilized Maintenance
$25
Free
VITA 58.1- (S)
Line Replaceable Integrated Electronics Chassis Standard, Liquid Cooled Chassis
The objective of this standard is to identify the particular requirements for a chassis configuration conforming to the VITA 58.0 base standard.
VITA Stabilized Maintenance
$25
Free
ANSI/VITA 60- (R)
Alternative Connector for VPX
This standard provides an alternate connector to the one specified in the VITA 46.0 VPX Baseline Standard. Because the VITA 46.0 and the VITA 60.0 connectors are not intermateable, a VITA 60.0 module will not plug into a VITA 46.0.0 backplane and vice versa. However, the VITA 60.0 standard provides VPX users with the flexibility to choose a VPX module and backplane connector combination for their specific application requirements.
ANSI/VITA Reaffirmed
$50
Free
ANSI/VITA 61.0-
XMC 2.0
This standard is based upon VITA 42.0 XMC. It defines an open standard for supporting high-speed, switched interconnect protocols on the existing, widely deployed XMC form factor. XMC 2.0 utilizes a ruggedized, higher speed mezzanine interconnect based on pin and socket technology featuring multiple points of contact. This revision addresses additional connector stack heights, lower mating force variants and support for higher data rate protocols.
ANSI/VITA Approved
$25
Free
ANSI/VITA 62.0-
Modular Power Supply Standard
This standard provides requirements building a power supply module that can be used to power a VPX chassis. The module will fit within the standard envelope defined for VPX modules in the VITA 48.x standards.
This revision updates the standard to better define current configurations and usage. The changes are delineated in the Forward of this standard.
ANSI/VITA Approved
$100
Free
ANSI/VITA 62.1-
Three Phase High-Voltage Power Supply Front-End in a 3U Plug-In Module Standard
This standard provides requirements for a Three Phase High-Voltage Power Supply Front-End in a 3U Plug-In Module that can be used to power a VPX chassis in the VITA 62 family of standards. The Plug-In Module will fit within the standard envelope defined for VPX Plug-In Modules in the VITA 48.0 standards.
ANSI/VITA Approved
$50
Free
ANSI/VITA 62.2-
Modular Power Supply Standard for 270v Applications
This standard provides requirements for building a 270 volt/3U or 6U class power supply module that can be used to power a VPX chassis in the VITA 62 family of standards in high altitude applications. The module will fit within the standard envelope defined for VPX modules in the VITA 48.0 standards.
ANSI/VITA Approved
$100
Free
ANSI/VITA 63.0- (R)
Hyperboloid Alternative Connector for VPX
This document describes an open standard for VITA 63.0 Hyperboloid Alternative Connector for VPX. This standard provides an alternative connector to the one specified in the VITA 46.0 VPX Baseline Standard. Because the 46.0 and the 63.0 connectors are not intermateable, a VITA 63.0 module will not plug into a VITA 46.0 backplane and vice versa. However, the VITA 63.0 draft standard provides VPX users with the flexibility to choose a VPX module and backplane connector combination for their specific application requirements.
ANSI/VITA Reaffirmed
$50
Free
ANSI/VITA 66.0- (R)
Optical Interconnect on VPX –Base
This standard defines a family of blind mate Fiber Optic interconnects for use with VPX backplanes and plug-in modules.
ANSI/VITA Reaffirmed
$25
Free
VITA 66.1-
Optical Interconnect on VPX –MT Variant
This standard defines a family of blind mate Fiber Optic interconnects for use with VITA 46 backplanes and plug-in modules, MT Variant.
VITA Stabilized Maintenance
$25
Free
ANSI/VITA 66.2- (S)
Optical Interconnect On VPX –ARINC 801 Termini Variant
This standard defines a family of blind mate Fiber Optic interconnects for use with VITA 46 backplanes and plug-in modules, ARINC 801.
ANSI/VITA Stabilized Maintenance
$25
Free
ANSI/VITA 66.3- (R)
Optical Interconnect on VPX - Mini-Expanded Beam Variant
This standard defines a family of blind mate Fiber Optic interconnects for use with VITA 46 backplanes and plug-in modules, Mini-Expanded Beam Variant.
ANSI/VITA Reaffirmed
$25
Free
ANSI/VITA 66.4- (R)
Optical Interconnect On VPX –Half Width MT Variant
This standard defines a family of blind mate Fiber Optic interconnects for use with VITA 46 backplanes and plug-in modules, Half Width MT Variant.
ANSI/VITA Reaffirmed
$25
Free
ANSI/VITA 66.5- +Errata
Optical Interconnect on VPX - Hybrid Variants
This document describes an open standard for configuration and interconnect within the structure of VITA 66.0 enabling an interface compatible with VITA 46 containing blind mate optical connectors with fixed contacts on the Plug-In Module and floating displacement on the backplane.
ANSI/VITA Approved
$50
Free
ANSI/VITA 67.0-
Coaxial Interconnect on VPX –Base Standard
This standard establishes a structure for implementing blind mate analog coaxial interconnects with VPX backplanes and plug-in modules, and to define a specific family of interconnects and configurations within that structure.
ANSI/VITA Approved
$25
Free
ANSI/VITA 67.0-
Coaxial Interconnect on VPX –Base Standard
This standard establishes a structure for implementing blind mate analog coaxial interconnects with VPX backplanes and plug-in modules, and to define a specific family of interconnects and configurations within that structure.
In process for reaffirmation or SM
$25
Free
ANSI/VITA 67.1-
Coaxial Interconnect on VPX, 4 Position SMPM Configuration
This standard details the configuration and interconnect within the structure of VITA 67.0 enabling a VITA 46 interface containing multi-position blind mate analog connectors with up to 4 SMPM contacts.
ANSI/VITA Approved
$25
Free
Coaxial Interconnect on VPX, 4 Position SMPM Configuration
This standard details the configuration and interconnect within the structure of VITA 67.0 enabling a VITA 46 interface containing multi-position blind mate analog connectors with up to 4 SMPM contacts.
In process for reaffirmation or SM
$25
Free
ANSI/VITA 67.2-
Coaxial Interconnect on VPX, 8 Position SMPM Configuration
This standard details the configuration and interconnect within the structure of VITA 67.0 enabling a VITA 46 interface containing multi-position blind mate analog connectors with up to 8 SMPM contacts.
ANSI/VITA Approved
$25
Free
ANSI/VITA 67.3-
Coaxial Interconnect on VPX - Spring-Loaded Contact on Backplane
This document describes an open standard for configuration and interconnect within the structure of VITA 67.0 enabling an interface compatible with VITA 46 containing multi-position blind mate analog connectors with coaxial contacts, having fixed contacts on the Plug-In Module and spring action on the backplane. This revision adds 75-Ohm SMPM and 75-Ohm NanoRF contact interfaces to support video applications.
ANSI/VITA Approved
$50
Free
ANSI/VITA 68.0-
VPX Compliance Channel Standard
VITA 68.0 is the Base Standard of the VITA 68.x family of standards for signal integrity compliance of VPX systems and components. This standard provides an overview of the VITA 68.x family of standards and defines common requirements for VPX modules and VPX backplanes that apply across the range of VITA 68.x standards.
This revision updates the VITA 68.x list of dot-specs and status to be current, and standardizes more terminology to be consistent with current VITA standards.
ANSI/VITA Approved
$25
Free
ANSI/VITA 68.1-
VPX Compliance Channel - Fixed Signal Integrity Budget Standard
VITA 68.1 is part of the VITA 68.x family of standards for signal integrity compliance of VPX systems and components. Refer to VITA 68.0 for an overview of the VITA 68.x family of standards.
This standard defines a VPX compliance channel fixed signal Integrity budget including Plug-In Module performance criteria and common Backplane performance criteria required to support multiple fabric types across a range of defined baud rates up to 10. Gbaud. This allows Backplane developers to design a VITA 68.1 compliant Backplane that supports required bit error rates (BER) for multiple fabric types when used with Plug-In Modules that are compliant to VITA 68.1 budget criteria. This also allows Plug-In Module developers to design VITA 68.1 compliant Plug-In Modules that are interoperable with other VITA 68.1 compliant Plug-In Modules when used with a VITA 68.1 compliant Backplane.
VITA 68.1 defines a single budget encompassing Plug-In Modules and Backplanes at various baud rates, with a “large system budget ”that supports interoperability of VITA 68.1 compliant Plug-In Modules with any VITA 68.1 compliant Backplane, including large slot count Backplanes with relatively long traces.
i. This approach supports mix and match interoperability between VITA 68.1 compliant Plug-In Modules and Backplanes for the system integrator without requiring application-specific signal integrity efforts
ii. This approach does not support more complex systems, e.g. ones with transceivers on mezzanine cards. These more complex systems are outside the scope of VITA 68.1; refer to VITA 68.x dot specs.
This revision incorporates the errata from the previous version, and standardizes more terminology to be consistent with current VITA standards.
ANSI/VITA Approved
$50
Free
ANSI/VITA 68.2-
VPX Standard S-Parameter Definition
This standard leverages the VITA 68.0 S-parameter definition and expands upon how the S-parameters are formatted and named to help system integrators easily take multiple vendor S-parameters, concatenate them together to analyze an entire channel from one Module to another Module.
ANSI/VITA Approved
$25
Free
VITA 68.3--VDSTU
Reference SI Model Standard for Gen4 and Higher Speeds
This document defines a standard reference model approach for OpenVPX Signal Integrity compliance at baud rates above 10. Gbaud. It defines reference OpenVPX Plug-In Module and backplane s-parameter models that can be used to create end-end OpenVPX reference channels in conjunction with reference VPX connector and device s-parameter models. Signal Integrity compliance for an OpenVPX Plug-In Module or backplane is based on simulation of end-end channel compliance against the requirements of the applicable protocol standard.
VITA Trial Use
$50
Free
ANSI/VITA 74.0-
Compliant System Small Form Factor Module (VNX) Base Standard
This standard meets the growing needs for improved Size, Weight and Power (SWaP) with a rugged, low cost, fast serial fabric interconnect based Plug-In Module, whilst leveraging many proven features of existing VITA standards. This revision documents the migration from VITA 74 VNX to VITA 90 VNX+ family of standards, adds revised voltage levels for specific signals, as well as corrected connector part numbers and drawings.
ANSI/VITA Approved
$100
Free
ANSI/VITA 76- (R)
High Performance Cable -
Ruggedized 10 Gbaud Bulkhead Connector for Cu and AOC Cables
This standard defines a rugged standardized 10 Gbaud interconnect system with high pin count and high density for I/O. It is capable of supporting multiple protocols and power while being interoperable with both Copper Cabling and Active Optic Cabling.
ANSI/VITA Reaffirmed
$50
Free
ANSI/VITA 78.0-
SpaceVPX System Standard
This document describes an open standard for creating high performance fault tolerant interoperable backplanes and modules to assemble electronic systems for spacecraft and other high availability applications. Such systems support a wide variety of use cases across the aerospace community. This standard leverages the OpenVPX standards family and the commercial infrastructure that supports these standards.
This revision adds additional profiles, additional communication protocols (such as Ethernet), higher speed copper connectors, and an updated naming methodology for Slot and Module Profiles.
ANSI/VITA Approved
$100
Free
ANSI/VITA 86-
High Voltage Input Sealed Connector Power Supply
This standard defines an environmentally sealed connector pair which is compatible with the backplane footprint as defined in VITA 62.0 for 3U power supplies operating in harsh environments operating off of a high voltage input. This revision tbd …
ANSI/VITA Approved
$50
Free
ANSI/VITA 87.0-
High Density (HD) MT Circular Connector - Type 1
This document defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL-STD-. MT offer options for 12 or 24 fibers per MT and for physical contact or lensed MT.
ANSI/VITA Approved
$50
Free
ANSI/VITA 88.0-
Switched Mezzanine Card Plus (XMC+) Standard
This document defines a standard for improved electrical/mechanical mezzanine connectors for XMC applications. Mechanically, the proposed connector is compatible with VITA 42/61 footprints achieving backward compatibility while offering improved mating/unmating forces. Electrically, speeds up to PCIe Gen 5 (32 Gbps) and maximum SI performance are supported.
ANSI/VITA Approved
$50
Free