Relationship between electroplated zinc layer thickness and plating time

31, Jul. 2025

The thickness of an electroplated zinc layer is directly related to the plating time, following Faraday's laws of electrolysis. Here’s how they are connected:

 

Author: Robby

The thickness of an electroplated zinc layer is directly related to the plating time, following Faraday's laws of electrolysis. Here’s how they are connected:

Key Factors Affecting Zinc Layer Thickness:

  1. Plating Time (t):

    • Longer plating time = thicker zinc deposit.

    • The relationship is linear under constant current density and efficiency.

  2. Current Density (i):

    • Higher current = faster deposition (but excessive current can cause poor quality).

  3. Cathodic Efficiency (η):

    • Not all current contributes to plating (some is lost to side reactions like hydrogen evolution).

    • Typical zinc plating efficiency: 70–95% depending on bath chemistry.

  4. Electrochemical Equivalent (Z):

    • For zinc, Z ≈ 0.0202 g/Ah (grams per amp-hour).


Mathematical Relationship:

The thickness (d) of the zinc coating can be calculated using:

d=M⋅i⋅t⋅ηn⋅F⋅ρ×104(in microns, μm)d=n⋅F⋅ρM⋅i⋅t⋅η​×104(in microns, μm)

Where:

  • M = Molar mass of zinc (65.38 g/mol)

  • i = Current density (A/dm²)

  • t = Plating time (hours)

  • η = Cathodic efficiency (decimal, e.g., 0.9 for 90%)

  • n = Number of electrons in reaction (Zn²⁺ + 2e⁻ → Zn, so n = 2)

  • F = Faraday’s constant (96,485 C/mol)

  • ρ = Density of zinc (7.14 g/cm³)

Simplified Formula:
For practical purposes, in a standard zinc sulfate or cyanide bath:

d≈8.2×i×t×η(μm)d≈8.2×i×t×η(μm)

*(Example: At 2 A/dm² for 30 min (0.5 h) with 85% efficiency → d ≈ 8.2 × 2 × 0.5 × 0.85 ≈ 7 μm)*


Practical Considerations:

  • Initial Adhesion: Very short times may lead to non-uniform nucleation.

  • Limitations: Beyond a certain thickness, roughness or dendrites may form.

  • Agitation & Temperature: Affect deposition rate and quality.

For precise control, measure thickness using:

  • Micrometer (before/after plating)

  • X-ray fluorescence (XRF)

  • Magnetic or eddy current gauges