Shop – Intermas Electronic Enclosures

02, Sep. 2024

 

Shop – Intermas Electronic Enclosures

The special design features of the RFISHIELDED subrack: ' The refined RFI shielding concept enables high shielding effectiveness. ' The stable stainless steel contact springs ensure permanent and reliable bonding, even after a large number of  plug-in cycles. ' The perforated RFI cover plates guarantee optimal air flow for improved heat dissipation. ' The use of high-quality, seawater-resistant aluminum alloys and  stainless steel materials removes, for the most part, the need for unnecessary, environmentally harmful surface treatment. THERE ARE 3 VERSIONS OF THIS SUBRACK 1. Subrack RFI-SHIELDED The standard RFI-shielded version. 2.  The front is in accordance with IEEE .10. The special profile rail is designed for the use of inser tion and removal handles (optionally with a hot swap function) for overcoming high insertion and removal resistance.  The card guides are fitted with mechanical coding systems and special bonding for electrostatic discharge. 3.  The front and the rear are in accordance with IEEE .10/11. This enables insertion and removal of modules with a front panel from both the front and the rear of the subrack.

The system dimensions of the RFI- SHIELDED subrack are based on those of the FLEXIBLE subrack as a logical further development to produce the perfectly shielded subrack. This allows unrestricted use of the extensive and complete range of accessories.' The refined RFI shielding concept enables high shielding effectiveness. ' The stable stainless steel contact springs ensure permanent and reliable bonding, even after a large number of plug-in cycles. ' The perforated RFI cover plates guarantee optimal air flow for improved heat dissipation. ' The use of high-quality, seawater-resistant aluminum alloys and stainless steel materials removes, for the most part, the need for unnecessary, environmentally harmful surface treatment.1. Subrack RFI-SHIELDED The standard RFI-shielded version. Subrack RFI-SHIELDED IEEE The front is in accordance with IEEE .10. The special profile rail is designed for the use of inser tion and removal handles (optionally with a hot swap function) for overcoming high insertion and removal resistance. The card guides are fitted with mechanical coding systems and special bonding for electrostatic discharge. Subrack RFI-SHIELDED IEEE / Rear I/O The front and the rear are in accordance with IEEE .10/11. This enables insertion and removal of modules with a front panel from both the front and the rear of the subrack.

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