(2) Replication of target composition in the deposited films.
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(3) Capable of in-situ cleaning prior to film deposition by reversing the potential on the electrodes .
(4) Better film quality and step coverage than evaporation.
(5) This is partly because adatoms are more energetic, and film is 'densified' by in-situ ion bombardment, and it is easier to heat up to high T than evaporation that is in vacuum.
(6) More reproducible deposition control ' same deposition rate for same process parameters (not true for evaporation), so easy film thickness control via time.
(7) Can use large area targets for uniform thickness over large substrates.
(8) Sufficient target material for many depositions.
(9) No x-ray damage.
(1) Substrate damage due to ion bombardment or UV generated by plasma.(2) Higher pressures 1 '100 mtorr ( < 10-5 torr in evaporation), more contaminations unless using ultra clean gasses and ultra clean targets.
(3) Deposition rate of some materials quite low.
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(4) Some materials (e.g., organics) degrade due to ionic bombardment.
(5) Most of the energy incident on the target becomes heat, which must be removed.
Although the rotary targets have developed in recent years, the mainstream shape of the sputtering target is still the planar type. Today let us take a look at the pros and cons of planar targets to help you determine whether a planar sputtering target is suitable for your project.
Simple structure ' one of the main advantages of the planar target is that the structure is simple. The common planar targets on the market are rectangular planar targets and circular planar targets, which are easily produced by molds. In other words, planar target preparation requires fewer machines and technologies and is easier to prepare. This is why planar targets still dominate the sputtering target market.
Low price ' You can never deny that the price is always an important competitive factor. As mentioned above, the manufacturing process of the planar sputter target is easier, so its price is much lower than the rotatory sputter target.
Strong versatility ' Planar sputtering targets usually have strong versatility. Therefore, the transportation of the planar targets is relatively simple and is not easily damaged during transportation.
Good uniformity and repeatability ' Film layers sputtered by planar targets usually boast good uniformity and repeatability. Planar targets are still best suited for prototype work or elemental experimentation, especially when large amounts of material are not needed at once.
Its biggest disadvantage is the low utilization rate (generally only about 20%). In the sputtering process of the planar target, a strip-shaped pit will be formed when the target of the glow region (the magnetic field distribution region) is consumed to a certain extent, making the target body thinner. And once the pit depth reaches a certain value, the target cannot be utilized anymore. The low utilization rate also reduces its price advantage to some extent.
In conclusion, planar targets are still the best choice for prototype work or elemental experimentation, especially when large amounts of material are not needed at once. But its disadvantage of low utilization rate (20% vs. 80% compared with the rotatory target) does constrain its development.
Next week, let us look at the biggest competitor of the planar target' the rotatory target. Weighting the pros and cons of these two types of sputtering target may help you better choose the one for your application.
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